Date To Be Announced
Failure analysis involves much more than complex IC's and expensive lab equipment. Ordinary
components fail more often than complex IC's. Each integrated circuit on the circuit board is
supported and protected by a complex array of diodes, transistors, capacitors, resistors and
other components. In recent years, because of surface mount, shrinkage of component footprints,
and thermal densities these components are beginning to fail more often and in most circuits
there can be no sacrificial elements. Analysts need to know what to look for, how to look,
and how to get into the protective packaging without destroying the vital evidence.
This Symposium includes a tutorial and technical sessions for both the technician, lab
engineer and their manager so they have some idea of what can be done and the basic skills
and equipment that will get them started in doing real world failure analysis.
A tutorial seminar will be offered on current issues of interest to
Technical papers will be presented on a wide range of failure analysis practices and case
studies ranging from ICs, capacitors, dendrite growth to burned boards and wiring. These
sessions provide excellent information on analysis techniques and the results of case studies.
Exhibits and Reception
Exhibits will be available during the Tuesday lunch breaks and evening reception. Anyone
interested in exhibiting should contact the CTI Office for information.
Advance registration will be published
To be provided